Vulnerabilities > Qualcomm > Sdx55 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-03-10 | CVE-2022-33245 | Use After Free vulnerability in Qualcomm products Memory corruption in WLAN due to use after free | 7.8 |
| 2023-03-10 | CVE-2022-33250 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in modem when network repeatedly sent invalid message container for NR to LTE handover. | 7.5 |
| 2023-03-10 | CVE-2022-33254 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem while processing SIB1 Message. | 7.5 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |
| 2023-03-10 | CVE-2022-33272 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in modem due to reachable assertion. | 7.5 |
| 2023-03-10 | CVE-2022-40530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase. | 7.8 |
| 2023-03-10 | CVE-2022-40531 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in WLAN due to incorrect type cast while sending WMI_SCAN_SCH_PRIO_TBL_CMDID message. | 7.8 |
| 2023-02-12 | CVE-2022-33232 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking size of input while running memory sharing tests with large scattered memory. | 7.8 |
| 2023-02-12 | CVE-2022-33233 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to configuration weakness in modem wile sending command to write protected files. | 7.8 |
| 2023-02-12 | CVE-2022-33243 | Unspecified vulnerability in Qualcomm products Memory corruption due to improper access control in Qualcomm IPC. | 7.8 |