Vulnerabilities > Qualcomm > Sdm850 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2020-03-05 CVE-2019-14085 Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Possible Integer underflow in WLAN function due to lack of check of data received from user side in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCN7605, QCS605, SDA845, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130
local
low complexity
qualcomm CWE-191
7.8
2020-03-05 CVE-2019-14081 Out-of-bounds Read vulnerability in Qualcomm products
Buffer Over-read when WLAN module gets a WMI message for SAR limits with invalid number of limits to be enforced in Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8098, IPQ8074, MSM8998, QCA8081, QCN7605, QCS605, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM8150, SXR1130
local
low complexity
qualcomm CWE-125
7.1
2020-03-05 CVE-2019-14071 Unspecified vulnerability in Qualcomm products
Compromised reset handler may bypass access control due to AC config is being reset if debug path is enabled to collect secure or non-secure ram dumps in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8017, APQ8053, APQ8096, APQ8096AU, IPQ6018, MDM9205, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS404, QCS405, QCS605, QM215, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130, SXR2130
local
low complexity
qualcomm
7.8
2020-03-05 CVE-2019-14050 Out-of-bounds Write vulnerability in Qualcomm products
Out-of-bound writes occurs due to lack of check of buffer size will cause buffer overflow only in 32bit architecture.
local
low complexity
qualcomm CWE-787
7.8
2020-03-05 CVE-2019-14030 Classic Buffer Overflow vulnerability in Qualcomm products
The size of a buffer is determined by addition and multiplications operations that have the potential to overflow due to lack of bound check in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, Rennell, SC8180X, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130
local
low complexity
qualcomm CWE-120
7.8
2020-03-05 CVE-2019-14028 Out-of-bounds Write vulnerability in Qualcomm products
Buffer overwrite during memcpy due to lack of check on SSID length validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
local
low complexity
qualcomm CWE-787
7.8
2020-03-05 CVE-2019-14027 Classic Buffer Overflow vulnerability in Qualcomm products
Buffer overflow due to lack of upper bound check on channel length which is used for a loop.
local
low complexity
qualcomm CWE-120
7.8
2020-03-05 CVE-2019-14026 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow in WLAN WMI handler due to lack of ssid length check when copying data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996AU, MSM8998, Nicobar, QCA6174A, QCA6574, QCA6574AU, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
local
low complexity
qualcomm CWE-120
7.8
2020-03-05 CVE-2019-14015 Out-of-bounds Write vulnerability in Qualcomm products
A stack-based buffer overflow exists in the initialization of the identification stage due to lack of check on the number of templates provided.
local
low complexity
qualcomm CWE-787
7.8
2020-03-05 CVE-2019-14000 Out-of-bounds Write vulnerability in Qualcomm products
Lack of check that the RX FIFO write index that is read from shared RAM is less than the FIFO size results into memory corruption and potential information leakage in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCS404, QCS405, QCS605, QM215, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
local
low complexity
qualcomm CWE-787
7.8