Vulnerabilities > Qualcomm > Sdm845 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2020-03-05 CVE-2019-14030 Classic Buffer Overflow vulnerability in Qualcomm products
The size of a buffer is determined by addition and multiplications operations that have the potential to overflow due to lack of bound check in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9205, QCS404, Rennell, SC8180X, SDM845, SDM850, SDX55, SM6150, SM7150, SM8150, SM8250, SXR2130
local
low complexity
qualcomm CWE-120
7.2
2020-03-05 CVE-2019-14029 Use After Free vulnerability in Qualcomm products
Use-after-free in graphics module due to destroying already queued syncobj in error case in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9607, MSM8909W, MSM8953, MSM8996AU, Nicobar, QCS405, QCS605, Rennell, SA6155P, Saipan, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
local
low complexity
qualcomm CWE-416
7.2
2020-03-05 CVE-2019-14028 Out-of-bounds Write vulnerability in Qualcomm products
Buffer overwrite during memcpy due to lack of check on SSID length validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8064, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996AU, MSM8998, Nicobar, QCA4531, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
local
low complexity
qualcomm CWE-787
7.2
2020-03-05 CVE-2019-14027 Classic Buffer Overflow vulnerability in Qualcomm products
Buffer overflow due to lack of upper bound check on channel length which is used for a loop.
local
low complexity
qualcomm CWE-120
7.2
2020-03-05 CVE-2019-14026 Classic Buffer Overflow vulnerability in Qualcomm products
Possible buffer overflow in WLAN WMI handler due to lack of ssid length check when copying data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8996AU, MSM8998, Nicobar, QCA6174A, QCA6574, QCA6574AU, QCA6584AU, QCA8081, QCA9377, QCA9379, QCA9886, QCN7605, QCS404, QCS405, QCS605, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
local
low complexity
qualcomm CWE-120
7.2
2020-03-05 CVE-2019-14015 Out-of-bounds Write vulnerability in Qualcomm products
A stack-based buffer overflow exists in the initialization of the identification stage due to lack of check on the number of templates provided.
local
low complexity
qualcomm CWE-787
7.2
2020-03-05 CVE-2019-14000 Out-of-bounds Write vulnerability in Qualcomm products
Lack of check that the RX FIFO write index that is read from shared RAM is less than the FIFO size results into memory corruption and potential information leakage in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking in APQ8009, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, IPQ6018, IPQ8074, MDM9150, MDM9205, MDM9206, MDM9607, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCA8081, QCM2150, QCS404, QCS405, QCS605, QM215, Rennell, SA6155P, SC8180X, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
local
low complexity
qualcomm CWE-787
7.2
2020-03-05 CVE-2019-10604 Out-of-bounds Write vulnerability in Qualcomm products
Possibility of heap-buffer-overflow during last iteration of loop while populating image version information in diag command response packet, in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8053, APQ8096AU, APQ8098, MDM9607, MDM9640, MSM8909W, MSM8917, MSM8953, Nicobar, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDM429, SDM439, SDM450, SDM632, SDM670, SDM710, SDM845, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
local
low complexity
qualcomm CWE-787
7.2
2020-03-05 CVE-2019-10591 NULL Pointer Dereference vulnerability in Qualcomm products
Null pointer dereference can happen when parsing udta atom which is non-standard and having invalid depth in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8017, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8909W, MSM8917, MSM8939, MSM8953, MSM8996, MSM8996AU, MSM8998, Nicobar, QCS405, QCS605, QM215, Rennell, SA6155P, Saipan, SDA660, SDA845, SDM429, SDM429W, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130
network
low complexity
qualcomm CWE-476
7.8
2020-03-05 CVE-2019-10569 Out-of-bounds Write vulnerability in Qualcomm products
Stack buffer overflow due to instance id is misplaced inside definition of hardware accelerated effects in makefile in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Mobile in APQ8053, APQ8098, MDM9607, MDM9640, MSM8998, QCS605, SC8180X, SDM439, SDM630, SDM636, SDM660, SDM845, SDX24, SDX55, SM6150, SM7150, SM8150, SXR1130
local
low complexity
qualcomm CWE-787
7.2