Vulnerabilities > Qualcomm > Sdm845 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-06-06 | CVE-2023-21670 | Incorrect Authorization vulnerability in Qualcomm products Memory Corruption in GPU Subsystem due to arbitrary command execution from GPU in privileged mode. | 7.8 |
| 2023-05-02 | CVE-2022-40504 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network. | 7.5 |
| 2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
| 2023-05-02 | CVE-2023-21666 | Memory Leak vulnerability in Qualcomm products Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool. | 7.8 |
| 2023-04-13 | CVE-2022-33231 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in core while initializing the encryption key. | 7.8 |
| 2023-04-13 | CVE-2022-33269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in Core while DDR memory assignment. | 7.8 |
| 2023-04-13 | CVE-2022-33288 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information. | 8.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |