Vulnerabilities > Qualcomm > Sdm670 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-04-13 | CVE-2022-33288 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while sending SCM command to get write protection information. | 8.8 |
| 2023-04-13 | CVE-2022-33296 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow to buffer overflow in Modem while parsing Traffic Channel Neighbor List Update message. | 7.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
| 2023-04-13 | CVE-2022-40503 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Bluetooth Host while A2DP streaming. | 7.5 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |
| 2022-06-14 | CVE-2021-30327 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow in sahara protocol while processing commands leads to overwrite of secure configuration data in Snapdragon Mobile, Snapdragon Compute, Snapdragon Auto, Snapdragon IOT, Snapdragon Connectivity, Snapdragon Voice & Music | 7.2 |
| 2020-11-12 | CVE-2020-11202 | Out-of-bounds Write vulnerability in Qualcomm products Buffer overflow/underflow occurs when typecasting the buffer passed by CPU internally in the library which is not aligned with the actual size of the structure' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SA6145P, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA845, SDM640, SDM670, SDM710, SDM830, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM8150, SM8150P | 7.2 |
| 2020-11-12 | CVE-2020-11175 | Use After Free vulnerability in Qualcomm products u'Use after free issue in Bluetooth transport driver when a method in the object is accessed after the object has been deleted due to improper timer handling.' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009W, MSM8909W, QCS605, QM215, SA6155, SA6155P, SA8155, SA8155P, SDA640, SDA670, SDA855, SDM1000, SDM640, SDM670, SDM710, SDM845, SDX50M, SDX55, SDX55M, SM6125, SM6350, SM7225, SM7250, SM7250P, SM8150, SM8150P, SM8250, SXR1120, SXR1130, SXR2130, SXR2130P | 7.2 |
| 2020-11-02 | CVE-2020-3704 | Improper Input Validation vulnerability in Qualcomm products u'While processing invalid connection request PDU which is nonstandard (interval or timeout is 0) from central device may lead peripheral system enter into dead lock state.(This CVE is equivalent to InvalidConnectionRequest(CVE-2019-19193) mentioned in sweyntooth paper)' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in Agatti, APQ8009, APQ8017, APQ8053, AR9344, Bitra, IPQ5018, Kamorta, MDM9607, MDM9640, MDM9650, MSM8996AU, Nicobar, QCA6174A, QCA6390, QCA6574AU, QCA9377, QCA9886, QCM6125, QCN7605, QCS404, QCS405, QCS605, QCS610, QRB5165, Rennell, SA415M, SA515M, Saipan, SC7180, SC8180X, SDA845, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SDX24, SDX55, SM6150, SM7150, SM8150, SM8250, SXR1130, SXR2130 | 7.8 |
| 2020-11-02 | CVE-2020-3703 | Out-of-bounds Read vulnerability in Qualcomm products u'Buffer over-read issue in Bluetooth peripheral firmware due to lack of check for invalid opcode and length of opcode received from central device(This CVE is equivalent to Link Layer Length Overfow issue (CVE-2019-16336,CVE-2019-17519) and Silent Length Overflow issue(CVE-2019-17518) mentioned in sweyntooth paper)' in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music in APQ8053, APQ8076, AR9344, Bitra, Kamorta, MDM9206, MDM9207C, MDM9607, MSM8905, MSM8917, MSM8937, MSM8940, MSM8953, Nicobar, QCA6174A, QCA9377, QCM2150, QCM6125, QCS404, QCS405, QCS605, QCS610, QM215, Rennell, SC8180X, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SM6150, SM7150, SM8150, SXR1130 | 7.5 |