Vulnerabilities > Qualcomm > Sdm660 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2018-10-23 | CVE-2017-18171 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Improper input validation for GATT data packet received in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | 8.3 |
| 2018-10-23 | CVE-2017-18170 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Improper input validation in Bluetooth Controller function can lead to possible memory corruption in Snapdragon Mobile in version QCA9379, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, SD 845, SD 850, SDM630, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | 8.3 |
| 2018-09-20 | CVE-2018-11292 | Integer Overflow or Wraparound vulnerability in Qualcomm products In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows. | 7.2 |
| 2018-09-20 | CVE-2018-11269 | Improper Validation of Array Index vulnerability in Qualcomm products In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | 7.2 |
| 2018-09-20 | CVE-2018-11268 | Improper Validation of Array Index vulnerability in Qualcomm products In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016, a potential buffer overflow exists when parsing TFTP options. | 7.2 |
| 2018-09-20 | CVE-2018-11267 | Improper Validation of Array Index vulnerability in Qualcomm products In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20. | 7.2 |
| 2018-04-18 | CVE-2015-9222 | Resource Management Errors vulnerability in Qualcomm products In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, processing erroneous bitstreams may result in a HW freeze. | 7.8 |
| 2018-04-18 | CVE-2015-9217 | Unspecified vulnerability in Qualcomm products In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, certain malformed HVEC clips could cause an assertion to fail. | 7.2 |