Vulnerabilities > Qualcomm > Sdm660 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-04-04 | CVE-2018-11970 | Unspecified vulnerability in Qualcomm products TZ App dynamic allocations not protected from XBL loader in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile in MDM9206, MDM9607, MDM9650, MDM9655, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SD 8CX, SDA660, SDM630, SDM660, SXR1130 | 7.2 |
| 2019-04-04 | CVE-2018-11966 | Improper Input Validation vulnerability in Qualcomm products Undefined behavior in UE while processing unknown IEI in OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SM7150, Snapdragon_High_Med_2016, SXR1130 | 7.2 |
| 2019-02-25 | CVE-2018-13905 | Use After Free vulnerability in Qualcomm products KGSL syncsource lock not handled properly during syncsource cleanup can lead to use after free issue in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, QCS605, SD 210/SD 212/SD 205, SD 439 / SD 429, SD 712 / SD 710 / SD 670, SD 820A, SD 845 / SD 850, SD 855, SDM439, SDM660, SDX24. | 7.2 |
| 2019-02-25 | CVE-2018-13900 | Use After Free vulnerability in Qualcomm products Use-after-free vulnerability will occur as there is no protection for the route table`s rule in IPA driver in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in versions MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24. | 7.2 |
| 2019-02-25 | CVE-2018-11945 | Out-of-bounds Write vulnerability in Qualcomm products Improper input validation in wireless service messaging module for data received from broadcast messages can lead to heap overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in versions MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130. | 7.5 |
| 2019-02-25 | CVE-2018-11931 | Improper Input Validation vulnerability in Qualcomm products Improper access to HLOS is possible while transferring memory to CPZ in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in versions MDM9150, MDM9206, MDM9607, MDM9650, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | 7.2 |
| 2019-02-25 | CVE-2018-11289 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Data truncation during higher to lower type conversion which causes less memory allocation than desired can lead to a buffer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking in versions IPQ8074, MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCA8081, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | 7.2 |
| 2019-02-11 | CVE-2018-13888 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605. | 7.2 |
| 2019-02-11 | CVE-2018-11855 | Integer Overflow or Wraparound vulnerability in Qualcomm products If an end user makes use of SCP11 sample OCE code without modification it could lead to a buffer overflow when transmitting a CAPDU in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT and Snapdragon Mobile in versions MDM9607, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 636, SD 820, SD 820A, SD 835, SD 8CX, SDA660, SDM630, SDM660. | 7.2 |
| 2019-01-18 | CVE-2018-5881 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Improper validation of buffer length checks in the lwm2m device management protocol can leads to a buffer overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660 | 8.3 |