Vulnerabilities > Qualcomm > Sdm660 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2019-07-25 | CVE-2019-2308 | Unspecified vulnerability in Qualcomm products User application could potentially make RPC call to the fastrpc driver and the driver will allow the message to go through to the remote subsystem in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS405, QCS605, Qualcomm 215, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SDX20, SDX24 | 7.2 |
| 2019-07-25 | CVE-2019-2305 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound access when reason code is extracted from frame data without validating the frame length in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6574AU, QCA9377, QCA9379, QCS405, QCS605, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24 | 7.5 |
| 2019-07-25 | CVE-2019-2278 | Improper Verification of Cryptographic Signature vulnerability in Qualcomm products User keystore signature is ignored in boot and can lead to bypass boot image signature verification in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Mobile in MDM9607, MDM9640, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 712 / SD 710 / SD 670, SD 845 / SD 850, SDM660 | 7.2 |
| 2019-07-25 | CVE-2019-2254 | Information Exposure vulnerability in Qualcomm products Position determination accuracy may be degraded due to wrongly decoded information in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in MDM9150, MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 665, SD 675, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130 | 7.5 |
| 2019-07-25 | CVE-2019-2253 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can occur while parsing an ogg file with a corrupted comment block. | 7.5 |
| 2019-07-22 | CVE-2019-2287 | Out-of-bounds Write vulnerability in Qualcomm products Improper validation for inputs received from firmware can lead to an out of bound write issue in video driver. | 7.5 |
| 2019-07-22 | CVE-2019-2279 | Out-of-bounds Write vulnerability in Qualcomm products Shared memory gets updated with invalid data and may lead to access beyond the allocated memory. | 7.5 |
| 2019-07-22 | CVE-2019-2269 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Possible buffer overflow while processing the high level lim process action frame due to improper buffer length validation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in MDM9150, MDM9650, MSM8996AU, QCS405, QCS605, SD 625, SD 636, SD 665, SD 712 / SD 710 / SD 670, SD 730, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM630, SDM660, SDX20, SDX24, SXR1130 | 7.5 |
| 2019-07-22 | CVE-2018-13927 | Improper Authentication vulnerability in Qualcomm products Debug policy with invalid signature can be loaded when the debug policy functionality is disabled by using the parallel image loading in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS404, QCS605, SD 410/12, SD 636, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SD 8CX, SDA660, SDM630, SDM660, SXR1130 | 7.2 |
| 2019-07-22 | CVE-2018-13896 | Improper Access Control vulnerability in Qualcomm products XBL_SEC image authentication and other crypto related validations are accessible to a compromised OEM XBL Loader due to missing lock at XBL_SEC stage.. | 7.2 |