Vulnerabilities > Qualcomm > Sdm450 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-05-02 | CVE-2022-40504 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network. | 7.5 |
| 2023-05-02 | CVE-2023-21665 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Graphics while importing a file. | 7.8 |
| 2023-05-02 | CVE-2023-21666 | Memory Leak vulnerability in Qualcomm products Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool. | 7.8 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-04-13 | CVE-2022-33302 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in User Identity Module when APN TLV length is greater than command length. | 7.8 |
| 2023-04-13 | CVE-2022-40532 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption due to integer overflow or wraparound in WLAN while sending WMI cmd from host to target. | 7.8 |
| 2020-11-12 | CVE-2020-3639 | Improper Validation of Array Index vulnerability in Qualcomm products u'When a non standard SIP sigcomp message is received from the network, then there may be chances of using more UDVM cycle or memory overflow' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8017, APQ8037, APQ8053, MDM9250, MDM9607, MDM9628, MDM9640, MDM9650, MSM8108, MSM8208, MSM8209, MSM8608, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, QCM4290, QCM6125, QCS410, QCS4290, QCS603, QCS605, QCS610, QCS6125, QM215, QSM8350, SA415M, SA6145P, SA6150P, SA6155P, SA8150P, SA8155, SA8155P, SA8195P, SC7180, SC8180X, SC8180X+SDX55, SC8180XP, SDA429W, SDA640, SDA660, SDA670, SDA845, SDA855, SDM1000, SDM429, SDM429W, SDM439, SDM450, SDM455, SDM630, SDM632, SDM636, SDM640, SDM660, SDM670, SDM710, SDM712, SDM845, SDM850, SDX24, SDX50M, SDX55, SDX55M, SM4125, SM4250, SM4250P, SM6115, SM6115P, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM7250, SM7250P, SM8150, SM8150P, SM8350, SM8350P, SXR1120, SXR1130 | 10.0 |