Vulnerabilities > Qualcomm > Sdm429W Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-02-06 | CVE-2023-33064 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio when invoking callback function of ASM driver. | 5.5 |
| 2023-12-05 | CVE-2023-33070 | Improper Authentication vulnerability in Qualcomm products Transient DOS in Automotive OS due to improper authentication to the secure IO calls. | 5.5 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-04-13 | CVE-2022-33289 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card. | 6.8 |
| 2023-03-10 | CVE-2022-22075 | Unspecified vulnerability in Qualcomm products Information Disclosure in Graphics during GPU context switch. | 5.5 |
| 2023-01-09 | CVE-2022-22079 | Out-of-bounds Read vulnerability in Qualcomm products Denial of service while processing fastboot flash command on mmc due to buffer over read | 4.6 |
| 2023-01-09 | CVE-2022-33255 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in Bluetooth HOST while processing GetFolderItems and GetItemAttribute Cmds from peer device. | 6.5 |
| 2022-10-19 | CVE-2022-25664 | Incomplete Cleanup vulnerability in Qualcomm products Information disclosure due to exposure of information while GPU reads the data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-10-19 | CVE-2022-25666 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in service while trying to access maps by different threads in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2022-09-16 | CVE-2022-25654 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in kernel due to improper input validation while processing ION commands in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 6.7 |