Vulnerabilities > Qualcomm > Sdm429W Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-03-17 | CVE-2020-11188 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen while parsing received SDP values due to lack of NULL termination check on SDP in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.4 |
2021-03-17 | CVE-2020-11171 | Out-of-bounds Read vulnerability in Qualcomm products Buffer over-read can happen while parsing received SDP values due to lack of NULL termination check on SDP in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.4 |
2021-03-17 | CVE-2020-11166 | Out-of-bounds Read vulnerability in Qualcomm products Potential out of bound read exception when UE receives unusually large number of padding octets in the beginning of ROHC header in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.4 |
2021-02-22 | CVE-2020-11272 | Use After Free vulnerability in Qualcomm products Before enqueuing a frame to the PE queue for further processing, an entry in a hash table can be deleted and using a stale version later can lead to use after free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
2021-02-22 | CVE-2020-11269 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 8.3 |
2021-02-22 | CVE-2020-11204 | Improper Input Validation vulnerability in Qualcomm products Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.2 |
2021-02-22 | CVE-2020-11203 | Out-of-bounds Write vulnerability in Qualcomm products Stack overflow may occur if GSM/WCDMA broadcast config size received from user is larger than variable length array in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 3.6 |
2021-02-22 | CVE-2020-11177 | Unspecified vulnerability in Qualcomm products User can overwrite Security Code NV item without knowing current SPC due to improper validation of SPC code setting and device lock in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.2 |
2021-02-22 | CVE-2020-11170 | Classic Buffer Overflow vulnerability in Qualcomm products Out of bound memory access while playing music playbacks with crafted vorbis content due to improper checks in header extraction in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |
2020-11-12 | CVE-2020-3639 | Improper Validation of Array Index vulnerability in Qualcomm products u'When a non standard SIP sigcomp message is received from the network, then there may be chances of using more UDVM cycle or memory overflow' in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in APQ8009, APQ8017, APQ8037, APQ8053, MDM9250, MDM9607, MDM9628, MDM9640, MDM9650, MSM8108, MSM8208, MSM8209, MSM8608, MSM8905, MSM8909, MSM8917, MSM8920, MSM8937, MSM8940, MSM8953, MSM8996AU, QCM4290, QCM6125, QCS410, QCS4290, QCS603, QCS605, QCS610, QCS6125, QM215, QSM8350, SA415M, SA6145P, SA6150P, SA6155P, SA8150P, SA8155, SA8155P, SA8195P, SC7180, SC8180X, SC8180X+SDX55, SC8180XP, SDA429W, SDA640, SDA660, SDA670, SDA845, SDA855, SDM1000, SDM429, SDM429W, SDM439, SDM450, SDM455, SDM630, SDM632, SDM636, SDM640, SDM660, SDM670, SDM710, SDM712, SDM845, SDM850, SDX24, SDX50M, SDX55, SDX55M, SM4125, SM4250, SM4250P, SM6115, SM6115P, SM6125, SM6150, SM6150P, SM6250, SM6250P, SM7125, SM7150, SM7150P, SM7250, SM7250P, SM8150, SM8150P, SM8350, SM8350P, SXR1120, SXR1130 | 10.0 |