Vulnerabilities > Qualcomm > Sd888 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-02-11 | CVE-2021-35068 | NULL Pointer Dereference vulnerability in Qualcomm products Lack of null check while freeing the device information buffer in the Bluetooth HFP protocol can lead to a NULL pointer dereference in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2022-02-11 | CVE-2021-35069 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper validation of data length received from DMA buffer can lead to memory corruption. | 7.8 |
| 2022-02-11 | CVE-2021-35075 | NULL Pointer Dereference vulnerability in Qualcomm products Possible null pointer dereference due to lack of WDOG structure validation during registration in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-02-11 | CVE-2021-35077 | Use After Free vulnerability in Qualcomm products Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-01-13 | CVE-2021-30287 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to improper validation of symbols configured for PDCCH monitoring in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2022-01-13 | CVE-2021-30307 | Reachable Assertion vulnerability in Qualcomm products Possible denial of service due to improper validation of DNS response when DNS client requests with PTR, NAPTR or SRV query type in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.5 |
| 2022-01-13 | CVE-2021-30311 | Improper Validation of Array Index vulnerability in Qualcomm products Possible heap overflow due to lack of index validation before allocating and writing to heap buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-01-13 | CVE-2021-30313 | Use After Free vulnerability in Qualcomm products Use after free condition can occur in wired connectivity due to a race condition while creating and deleting folders in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.4 |
| 2022-01-13 | CVE-2021-30314 | Information Exposure vulnerability in Qualcomm products Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-01-13 | CVE-2021-30319 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow due to improper validation of command length parameters while processing WMI command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.8 |