Vulnerabilities > Qualcomm > Sd870 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-07-13 | CVE-2021-1970 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to lack of length check of FT sub-elements in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.5 |
| 2021-06-09 | CVE-2020-11267 | Out-of-bounds Write vulnerability in Qualcomm products Stack out-of-bounds write occurs while setting up a cipher device if the provided IV length exceeds the max limit value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2020-11292 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow in voice service due to lack of input validation of parameters in QMI Voice API in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-06-09 | CVE-2020-11298 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products While waiting for a response to a callback or listener request, non-secure clients can change permissions to shared memory buffers used by HLOS Invoke Call to secure kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.0 |
| 2021-06-09 | CVE-2020-11304 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read in DRM due to improper buffer length check. | 7.1 |
| 2021-06-09 | CVE-2020-11306 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow in RPMB counter due to lack of length check on user provided data in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-06-09 | CVE-2021-1937 | Reachable Assertion vulnerability in Qualcomm products Reachable assertion is possible while processing peer association WLAN message from host and nonstandard incoming packet in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.5 |
| 2021-05-07 | CVE-2020-11273 | NULL Pointer Dereference vulnerability in Qualcomm products Histogram type KPI was teardown with the assumption of the existence of histogram binning info and will lead to null pointer access when histogram binning info is missing due to lack of null check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile | 7.5 |
| 2021-05-07 | CVE-2020-11274 | Reachable Assertion vulnerability in Qualcomm products Denial of service in MODEM due to assert to the invalid configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2021-05-07 | CVE-2020-11284 | Improper Locking vulnerability in Qualcomm products Locked memory can be unlocked and modified by non secure boot loader through improper system call sequence making the memory region untrusted source of input for secure boot loader in Snapdragon Auto, Snapdragon Compute, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 7.8 |