Vulnerabilities > Qualcomm > Sd870 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2022-40524 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption due to buffer over-read in Modem while processing SetNativeHandle RTP service. | 7.8 |
| 2023-09-05 | CVE-2023-21636 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption due to improper validation of array index in Linux while updating adn record. | 7.8 |
| 2023-09-05 | CVE-2023-21644 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in RIL due to Integer Overflow while triggering qcril_uim_request_apdu request. | 7.8 |
| 2023-09-05 | CVE-2023-21646 | Reachable Assertion vulnerability in Qualcomm products Transient DOS in Modem while processing invalid System Information Block 1. | 7.5 |
| 2023-09-05 | CVE-2023-21654 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio during playback session with audio effects enabled. | 7.8 |
| 2023-09-05 | CVE-2023-21662 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core Platform while printing the response buffer in log. | 7.8 |
| 2023-09-05 | CVE-2023-21664 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core Platform while printing the response buffer in log. | 7.8 |
| 2023-09-05 | CVE-2023-28538 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region. | 7.8 |
| 2023-08-08 | CVE-2023-21626 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key. | 7.1 |
| 2023-08-08 | CVE-2023-21627 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in Trusted Execution Environment while calling service API with invalid address. | 7.8 |