Vulnerabilities > Qualcomm > Sd855 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2020-11-12 | CVE-2020-11208 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439 | 7.8 |
2019-05-24 | CVE-2018-11271 | Improper Authentication vulnerability in Qualcomm products Improper authentication can happen on Remote command handling due to inappropriate handling of events in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, QCS605, Qualcomm 215, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDA660, SDM439, SDM630, SDM660, SM7150, Snapdragon_High_Med_2016, SXR1130 | 9.8 |