Vulnerabilities > Qualcomm > Sd855 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-03-10 | CVE-2022-33254 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem while processing SIB1 Message. | 7.5 |
| 2023-03-10 | CVE-2022-33256 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption due to improper validation of array index in Multi-mode call processor. | 9.8 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |
| 2023-03-10 | CVE-2022-33260 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to stack based buffer overflow in core while sending command from USB of large size. | 7.8 |
| 2023-03-10 | CVE-2022-33278 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity. | 7.8 |
| 2023-03-10 | CVE-2022-40515 | Double Free vulnerability in Qualcomm products Memory corruption in Video due to double free while playing 3gp clip with invalid metadata atoms. | 9.8 |
| 2023-03-10 | CVE-2022-40530 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow in WLAN during initialization phase. | 7.8 |
| 2023-03-10 | CVE-2022-40531 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in WLAN due to incorrect type cast while sending WMI_SCAN_SCH_PRIO_TBL_CMDID message. | 7.8 |
| 2023-03-10 | CVE-2022-40537 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in Bluetooth HOST while processing the AVRC_PDU_GET_PLAYER_APP_VALUE_TEXT AVRCP response. | 9.8 |
| 2023-02-12 | CVE-2022-33232 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking size of input while running memory sharing tests with large scattered memory. | 7.8 |