Vulnerabilities > Qualcomm > Sd855 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-06-06 | CVE-2022-33226 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in Core while processing ioctl commands from diag client applications. | 7.8 |
| 2023-06-06 | CVE-2022-33227 | Double Free vulnerability in Qualcomm products Memory corruption in Linux android due to double free while calling unregister provider after register call. | 7.8 |
| 2023-06-06 | CVE-2022-33230 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in FM Host due to buffer copy without checking the size of input in FM Host | 7.8 |
| 2023-06-06 | CVE-2022-33251 | Reachable Assertion vulnerability in Qualcomm products Transient DOS due to reachable assertion in Modem because of invalid network configuration. | 7.5 |
| 2023-06-06 | CVE-2022-33263 | Use After Free vulnerability in Qualcomm products Memory corruption due to use after free in Core when multiple DCI clients register and deregister. | 7.8 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-33267 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Linux while sending DRM request. | 7.8 |
| 2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |