Vulnerabilities > Qualcomm > Sd855 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2023-09-05 | CVE-2023-21663 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption while accessing metadata in Display. | 7.8 |
2023-09-05 | CVE-2023-21664 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core Platform while printing the response buffer in log. | 7.8 |
2023-09-05 | CVE-2023-28538 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region. | 7.8 |
2023-09-05 | CVE-2023-28543 | Out-of-bounds Read vulnerability in Qualcomm products A malformed DLC can trigger Memory Corruption in SNPE library due to out of bounds read, such as by loading an untrusted model (e.g. | 9.8 |
2023-09-05 | CVE-2023-28544 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN while sending transmit command from HLOS to UTF handlers. | 7.8 |
2023-09-05 | CVE-2023-28557 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload. | 7.8 |
2023-09-05 | CVE-2023-28558 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN handler while processing PhyID in Tx status handler. | 7.8 |
2023-09-05 | CVE-2023-28559 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload. | 7.8 |
2023-09-05 | CVE-2023-28560 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | 7.8 |
2023-09-05 | CVE-2023-28562 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while handling payloads from remote ESL. | 9.8 |