Vulnerabilities > Qualcomm > Sd850 Firmware > Critical
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-08-08 | CVE-2022-40510 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder. | 9.8 |
| 2023-02-12 | CVE-2022-40514 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in reassoc response frame. | 9.8 |
| 2022-10-19 | CVE-2022-25748 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames. | 9.8 |
| 2022-09-02 | CVE-2022-22062 | Out-of-bounds Read vulnerability in Qualcomm products An out-of-bounds read can occur while parsing a server certificate due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.1 |
| 2022-06-14 | CVE-2021-35083 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to improper validation of certificate chain in SSL or Internet key exchange in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2022-06-14 | CVE-2021-30341 | Out-of-bounds Write vulnerability in Qualcomm products Improper buffer size validation of DSM packet received can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 9.8 |
| 2021-10-20 | CVE-2021-1980 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of length check while parsing beacon IE response in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 9.1 |
| 2021-09-09 | CVE-2021-1933 | Improper Validation of Array Index vulnerability in Qualcomm products UE assertion is possible due to improper validation of invite message with SDP body in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 9.8 |
| 2021-09-08 | CVE-2021-1920 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2021-09-08 | CVE-2021-1919 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur when the RTCP length is lesser than than the actual blocks present in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |