Vulnerabilities > Qualcomm > Sd835 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-07-01 | CVE-2024-23380 | Use After Free vulnerability in Qualcomm products Memory corruption while handling user packets during VBO bind operation. | 7.8 |
| 2024-02-06 | CVE-2023-33067 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while calling START command on host voice PCM multiple times for the same RX or TX tap points. | 7.8 |
| 2024-02-06 | CVE-2023-33068 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Audio while processing IIR config data from AFE calibration block. | 7.8 |
| 2024-02-06 | CVE-2023-33069 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Audio while processing the calibration data returned from ACDB loader. | 7.8 |
| 2024-02-06 | CVE-2023-33077 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in HLOS while converting from authorization token to HIDL vector. | 7.8 |
| 2024-02-06 | CVE-2023-43518 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in video while parsing invalid mp2 clip. | 9.8 |
| 2024-02-06 | CVE-2023-43519 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in video while parsing the Videoinfo, when the size of atom is greater than the videoinfo size. | 9.8 |
| 2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
| 2024-02-06 | CVE-2023-33064 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in Audio when invoking callback function of ASM driver. | 5.5 |
| 2024-02-06 | CVE-2023-33065 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure in Audio while accessing AVCS services from ADSP payload. | 7.1 |