Vulnerabilities > Qualcomm > Sd780G Firmware

DATE CVE VULNERABILITY TITLE RISK
2022-10-19 CVE-2022-25748 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in WLAN due to integer overflow to buffer overflow while parsing GTK frames.
network
low complexity
qualcomm CWE-190
critical
9.8
2022-10-19 CVE-2022-25749 Out-of-bounds Read vulnerability in Qualcomm products
Transient Denial-of-Service in WLAN due to buffer over-read while parsing MDNS frames.
network
low complexity
qualcomm CWE-125
7.5
2022-10-19 CVE-2022-33214 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Memory corruption in display due to time-of-check time-of-use of metadata reserved size in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
high complexity
qualcomm CWE-367
7.0
2022-09-16 CVE-2022-22066 Out-of-bounds Read vulnerability in Qualcomm products
Memory corruption occurs while processing command received from HLOS due to improper length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-125
7.8
2022-09-16 CVE-2022-22074 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory Corruption during wma file playback due to integer overflow in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-190
7.8
2022-09-16 CVE-2022-22092 Use After Free vulnerability in Qualcomm products
Memory corruption in kernel due to use after free issue in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-416
7.8
2022-09-16 CVE-2022-22093 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Memory corruption or temporary denial of service due to improper handling of concurrent hypervisor operations to attach or detach IRQs from virtual interrupt sources in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
high complexity
qualcomm CWE-367
7.0
2022-09-16 CVE-2022-22094 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
memory corruption in Kernel due to race condition while getting mapping reference in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
high complexity
qualcomm CWE-367
7.0
2022-09-16 CVE-2022-25653 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure in video due to buffer over-read while processing avi file in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-125
5.5
2022-09-16 CVE-2022-25656 Integer Overflow or Wraparound vulnerability in Qualcomm products
Possible integer overflow and memory corruption due to improper validation of buffer size sent to write to console when computing the payload size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-190
7.8