Vulnerabilities > Qualcomm > Sd765 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-04-07 | CVE-2020-11236 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to invalid value of total dimension in the non-histogram type KPI could lead to a denial of service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile | 5.5 |
| 2021-04-07 | CVE-2020-11231 | Double Free vulnerability in Qualcomm products Two threads call one or both functions concurrently leading to corruption of pointers and reference counters which in turn can lead to heap corruption in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |
| 2021-03-17 | CVE-2020-11308 | Improper Validation of Array Index vulnerability in Qualcomm products Buffer overflow occurs when trying to convert ASCII string to Unicode string if the actual size is more than required in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.8 |
| 2021-03-17 | CVE-2020-11230 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Potential arbitrary memory corruption when the qseecom driver updates ion physical addresses in the buffer as it exposes a physical address to user land in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 6.4 |
| 2021-03-17 | CVE-2020-11221 | Information Exposure vulnerability in Qualcomm products Usage of syscall by non-secure entity can allow extraction of secure QTEE diagnostic information in clear text form due to insufficient checks in the syscall handler and leads to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-03-17 | CVE-2020-11199 | Information Exposure vulnerability in Qualcomm products HLOS to access EL3 stack canary by just mapping imem region due to Improper access control and can lead to information exposure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2021-03-17 | CVE-2020-11186 | Infinite Loop vulnerability in Qualcomm products Modem will enter into busy mode in an infinite loop while parsing histogram dimension due to improper validation of input received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Mobile | 5.5 |
| 2021-02-22 | CVE-2020-3664 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read access in hypervisor due to an invalid read access attempt by passing invalid addresses in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.0 |
| 2021-02-22 | CVE-2020-11198 | Improper Cross-boundary Removal of Sensitive Data vulnerability in Qualcomm products Key material used for TZ diag buffer encryption and other data related to log buffer is not wiped securely due to improper usage of memset in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2021-02-22 | CVE-2020-11147 | Use After Free vulnerability in Qualcomm products Use after free issue in audio modules while removing and freeing objects during list iteration due to incorrect usage of macro in Snapdragon Compute, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |