Vulnerabilities > Qualcomm > Sd765 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-01-03 | CVE-2021-30282 | Improper Validation of Array Index vulnerability in Qualcomm products Possible out of bound write in RAM partition table due to improper validation on number of partitions provided in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30293 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to lack of input validation in PUSCH configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.5 |
| 2022-01-03 | CVE-2021-30298 | Classic Buffer Overflow vulnerability in Qualcomm products Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30303 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30336 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to lack of domain input validation while processing APK close session request in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2022-01-03 | CVE-2021-30337 | Use After Free vulnerability in Qualcomm products Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-11-12 | CVE-2021-1973 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products A FTM Diag command can allow an arbitrary write into modem OS space in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-11-12 | CVE-2021-1979 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer overflow due to improper validation of FTM command payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2021-11-12 | CVE-2021-1982 | Reachable Assertion vulnerability in Qualcomm products Possible denial of service scenario due to improper input validation of received NAS OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |
| 2021-11-12 | CVE-2021-30254 | Improper Input Validation vulnerability in Qualcomm products Possible buffer overflow due to improper input validation in factory calibration and test DIAG command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |