Vulnerabilities > Qualcomm > Sd730 Firmware > Medium
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2021-07-13 | CVE-2021-1897 | Out-of-bounds Read vulnerability in Qualcomm products Possible Buffer Over-read due to lack of validation of boundary checks when loading splash image in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
2021-07-13 | CVE-2021-1898 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over-read due to incorrect overflow check when loading splash image in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
2021-07-13 | CVE-2021-1899 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of length check while flashing meta images in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 4.6 |
2021-07-13 | CVE-2021-1901 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over-read due to lack of length check while flashing meta images in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 4.6 |
2021-07-13 | CVE-2021-1931 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of buffer length while processing fast boot commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.7 |
2021-05-07 | CVE-2020-11293 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.0 |
2021-05-07 | CVE-2021-1906 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper handling of address deregistration on failure can lead to new GPU address allocation failure. | 5.5 |
2021-04-07 | CVE-2020-11252 | Out-of-bounds Read vulnerability in Qualcomm products Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |
2021-03-17 | CVE-2020-11308 | Improper Validation of Array Index vulnerability in Qualcomm products Buffer overflow occurs when trying to convert ASCII string to Unicode string if the actual size is more than required in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.8 |
2021-03-17 | CVE-2020-11221 | Information Exposure vulnerability in Qualcomm products Usage of syscall by non-secure entity can allow extraction of secure QTEE diagnostic information in clear text form due to insufficient checks in the syscall handler and leads to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |