Vulnerabilities > Qualcomm > Sd730 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
| 2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
| 2024-01-02 | CVE-2023-33030 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in HLOS while running playready use-case. | 7.8 |
| 2024-01-02 | CVE-2023-33032 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. | 7.8 |
| 2024-01-02 | CVE-2023-33033 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio during playback with speaker protection. | 7.8 |
| 2024-01-02 | CVE-2023-33038 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while receiving a message in Bus Socket Transport Server. | 7.8 |
| 2024-01-02 | CVE-2023-33040 | Unspecified vulnerability in Qualcomm products Transient DOS in Data Modem during DTLS handshake. | 7.5 |
| 2024-01-02 | CVE-2023-33062 | Unspecified vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing a BTM request. | 7.5 |
| 2024-01-02 | CVE-2023-33109 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS while processing a WMI P2P listen start command (0xD00A) sent from host. | 7.5 |
| 2024-01-02 | CVE-2023-33114 | Use After Free vulnerability in Qualcomm products Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time. | 7.8 |