Vulnerabilities > Qualcomm > Sd710 Firmware

DATE CVE VULNERABILITY TITLE RISK
2021-05-07 CVE-2020-11295 Use After Free vulnerability in Qualcomm products
Use after free in camera If the threadmanager is being cleaned up while the worker thread is processing objects in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-416
7.8
2021-05-07 CVE-2021-1891 Use After Free vulnerability in Qualcomm products
A possible use-after-free occurrence in audio driver can happen when pointers are not properly handled in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8
2021-05-07 CVE-2021-1895 Integer Overflow or Wraparound vulnerability in Qualcomm products
Possible integer overflow due to improper length check while flashing an image in Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music
local
low complexity
qualcomm CWE-190
7.8
2021-05-07 CVE-2021-1905 Use After Free vulnerability in Qualcomm products
Possible use after free due to improper handling of memory mapping of multiple processes simultaneously.
local
low complexity
qualcomm CWE-416
7.8
2021-05-07 CVE-2021-1906 Improper Handling of Exceptional Conditions vulnerability in Qualcomm products
Improper handling of address deregistration on failure can lead to new GPU address allocation failure.
local
low complexity
qualcomm CWE-755
5.5
2021-05-07 CVE-2021-1910 Double Free vulnerability in Qualcomm products
Double free in video due to lack of input buffer length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-415
critical
9.8
2021-05-07 CVE-2021-1915 Classic Buffer Overflow vulnerability in Qualcomm products
Buffer overflow can occur due to improper validation of NDP application information length in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-120
7.8
2021-05-07 CVE-2021-1925 Reachable Assertion vulnerability in Qualcomm products
Possible denial of service scenario due to improper handling of group management action frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
network
low complexity
qualcomm CWE-617
7.5
2021-05-07 CVE-2021-1927 Use After Free vulnerability in Qualcomm products
Possible use after free due to lack of null check while memory is being freed in FastRPC driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-416
7.8
2021-04-07 CVE-2020-11255 Memory Leak vulnerability in Qualcomm products
Denial of service while processing RTCP packets containing multiple SDES reports due to memory for last SDES packet is freed and rest of the memory is leaked in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Wearables
network
low complexity
qualcomm CWE-401
7.5