Vulnerabilities > Qualcomm > Sd690 5G Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-04-01 | CVE-2021-35106 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to improper length calculation of WMI message. | 7.2 |
| 2022-02-11 | CVE-2021-30317 | Improper Authentication vulnerability in Qualcomm products Improper validation of program headers containing ELF metadata can lead to image verification bypass in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |
| 2022-02-11 | CVE-2021-30322 | Out-of-bounds Write vulnerability in Qualcomm products Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.2 |
| 2022-02-11 | CVE-2021-35068 | NULL Pointer Dereference vulnerability in Qualcomm products Lack of null check while freeing the device information buffer in the Bluetooth HFP protocol can lead to a NULL pointer dereference in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |
| 2022-02-11 | CVE-2021-35069 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper validation of data length received from DMA buffer can lead to memory corruption. | 7.2 |
| 2022-02-11 | CVE-2021-35077 | Use After Free vulnerability in Qualcomm products Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.2 |
| 2022-01-13 | CVE-2021-30308 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow while printing the HARQ memory partition detail due to improper validation of buffer size in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.2 |
| 2022-01-13 | CVE-2021-30311 | Improper Validation of Array Index vulnerability in Qualcomm products Possible heap overflow due to lack of index validation before allocating and writing to heap buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-01-13 | CVE-2021-30319 | Integer Overflow or Wraparound vulnerability in Qualcomm products Possible integer overflow due to improper validation of command length parameters while processing WMI command in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 7.2 |
| 2022-01-03 | CVE-2021-1894 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper access control in TrustZone due to improper error handling while handling the signing key in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.2 |