Vulnerabilities > Qualcomm > Sd675 Firmware > Medium

DATE CVE VULNERABILITY TITLE RISK
2021-03-17 CVE-2020-11220 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
While processing storage SCM commands there is a time of check or time of use window where a pointer used could be invalid at a specific time while executing the storage SCM call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking
local
high complexity
qualcomm CWE-367
6.4
2021-03-17 CVE-2020-11199 Information Exposure vulnerability in Qualcomm products
HLOS to access EL3 stack canary by just mapping imem region due to Improper access control and can lead to information exposure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-200
5.5
2021-02-22 CVE-2020-3664 Out-of-bounds Read vulnerability in Qualcomm products
Out of bound read access in hypervisor due to an invalid read access attempt by passing invalid addresses in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-125
6.0
2021-02-22 CVE-2020-11198 Improper Cross-boundary Removal of Sensitive Data vulnerability in Qualcomm products
Key material used for TZ diag buffer encryption and other data related to log buffer is not wiped securely due to improper usage of memset in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-212
6.7
2021-02-22 CVE-2020-11147 Use After Free vulnerability in Qualcomm products
Use after free issue in audio modules while removing and freeing objects during list iteration due to incorrect usage of macro in Snapdragon Compute, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-416
6.7