Vulnerabilities > Qualcomm > Sd675 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-01-03 | CVE-2021-30289 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Possible buffer overflow due to lack of range check while processing a DIAG command for COEX management in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-01-03 | CVE-2021-30293 | Reachable Assertion vulnerability in Qualcomm products Possible assertion due to lack of input validation in PUSCH configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT | 7.5 |
| 2022-01-03 | CVE-2021-30303 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of buffer length check when segmented WMI command is received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30335 | Reachable Assertion vulnerability in Qualcomm products Possible assertion in QOS request due to improper validation when multiple add or update request are received simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-01-03 | CVE-2021-30336 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to lack of domain input validation while processing APK close session request in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2022-01-03 | CVE-2021-30337 | Use After Free vulnerability in Qualcomm products Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2021-11-12 | CVE-2021-1921 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Possible memory corruption due to Improper handling of hypervisor unmap operations for concurrent memory operations in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.0 |
| 2021-11-12 | CVE-2021-1973 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products A FTM Diag command can allow an arbitrary write into modem OS space in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-11-12 | CVE-2021-1979 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer overflow due to improper validation of FTM command payload in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2021-11-12 | CVE-2021-1982 | Reachable Assertion vulnerability in Qualcomm products Possible denial of service scenario due to improper input validation of received NAS OTA message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.5 |