Vulnerabilities > Qualcomm > Sd675 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2024-09-02 | CVE-2024-33051 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while processing TIM IE from beacon frame as there is no check for IE length. | 7.5 |
| 2024-07-01 | CVE-2024-21461 | Double Free vulnerability in Qualcomm products Memory corruption while performing finish HMAC operation when context is freed by keymaster. | 7.8 |
| 2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
| 2024-07-01 | CVE-2024-21465 | Out-of-bounds Read vulnerability in Qualcomm products Memory corruption while processing key blob passed by the user. | 7.8 |
| 2024-07-01 | CVE-2024-21469 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption when an invoke call and a TEE call are bound for the same trusted application. | 7.8 |
| 2024-02-06 | CVE-2023-33072 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core while processing control functions. | 7.8 |
| 2024-02-06 | CVE-2023-33076 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. | 7.8 |
| 2024-02-06 | CVE-2023-43533 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware when the length of received beacon is less than length of ieee802.11 beacon frame. | 7.5 |
| 2024-02-06 | CVE-2023-43536 | Unspecified vulnerability in Qualcomm products Transient DOS while parse fils IE with length equal to 1. | 7.5 |
| 2024-01-02 | CVE-2023-33030 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in HLOS while running playready use-case. | 7.8 |