Vulnerabilities > Qualcomm > Sd670 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-33021 | Use After Free vulnerability in Qualcomm products Memory corruption in Graphics while processing user packets for command submission. | 7.8 |
| 2023-08-08 | CVE-2023-21626 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key. | 7.1 |
| 2023-08-08 | CVE-2023-21651 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE. | 7.8 |
| 2023-08-08 | CVE-2023-21652 | Use of Hard-coded Credentials vulnerability in Qualcomm products Cryptographic issue in HLOS as derived keys used to encrypt/decrypt information is present on stack after use. | 7.1 |
| 2023-08-08 | CVE-2023-22666 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Audio while playing amrwbplus clips with modified content. | 7.8 |
| 2023-08-08 | CVE-2023-28537 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption while allocating memory in COmxApeDec module in Audio. | 7.8 |
| 2023-07-04 | CVE-2023-21633 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Linux while processing QcRilRequestImsRegisterMultiIdentityMessage request. | 7.8 |
| 2023-07-04 | CVE-2023-22387 | Unspecified vulnerability in Qualcomm products Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption. | 7.8 |
| 2023-07-04 | CVE-2023-22667 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory Corruption in Audio while allocating the ion buffer during the music playback. | 7.8 |
| 2023-07-04 | CVE-2023-28542 | Out-of-bounds Read vulnerability in Qualcomm products Memory Corruption in WLAN HOST while fetching TX status information. | 7.8 |