Vulnerabilities > Qualcomm > Sd670 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-11-07 | CVE-2023-28545 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in TZ Secure OS while loading an app ELF. | 7.8 |
| 2023-11-07 | CVE-2023-28556 | Unspecified vulnerability in Qualcomm products Cryptographic issue in HLOS during key management. | 7.8 |
| 2023-11-07 | CVE-2023-33059 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Audio while processing the VOC packet data from ADSP. | 7.8 |
| 2023-10-03 | CVE-2023-21673 | Unspecified vulnerability in Qualcomm products Improper Access to the VM resource manager can lead to Memory Corruption. | 7.8 |
| 2023-10-03 | CVE-2023-24847 | NULL Pointer Dereference vulnerability in Qualcomm products Transient DOS in Modem while allocating DSM items. | 7.5 |
| 2023-10-03 | CVE-2023-24848 | Unspecified vulnerability in Qualcomm products Information Disclosure in Data Modem while performing a VoLTE call with an undefined RTCP FB line value. | 7.5 |
| 2023-10-03 | CVE-2023-24849 | Unspecified vulnerability in Qualcomm products Information Disclosure in data Modem while parsing an FMTP line in an SDP message. | 7.5 |
| 2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
| 2023-09-05 | CVE-2023-21662 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core Platform while printing the response buffer in log. | 7.8 |