Vulnerabilities > Qualcomm > Sd670 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2023-03-10 CVE-2022-25705 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in modem due to integer overflow to buffer overflow while handling APDU response
local
low complexity
qualcomm CWE-190
7.8
2023-03-10 CVE-2022-33213 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption in modem due to buffer overflow while processing a PPP packet
network
low complexity
qualcomm CWE-120
8.8
2023-03-10 CVE-2022-33242 Improper Authentication vulnerability in Qualcomm products
Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD.
local
low complexity
qualcomm CWE-287
7.8
2023-03-10 CVE-2022-33257 Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products
Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone.
local
high complexity
qualcomm CWE-367
7.0
2023-03-10 CVE-2022-33278 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity.
local
low complexity
qualcomm CWE-120
7.8
2023-03-10 CVE-2022-40531 Incorrect Type Conversion or Cast vulnerability in Qualcomm products
Memory corruption in WLAN due to incorrect type cast while sending WMI_SCAN_SCH_PRIO_TBL_CMDID message.
local
low complexity
qualcomm CWE-704
7.8
2023-02-12 CVE-2022-33232 Classic Buffer Overflow vulnerability in Qualcomm products
Memory corruption due to buffer copy without checking size of input while running memory sharing tests with large scattered memory.
local
low complexity
qualcomm CWE-120
7.8
2023-02-12 CVE-2022-33233 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption due to configuration weakness in modem wile sending command to write protected files.
local
low complexity
qualcomm CWE-787
7.8
2023-02-12 CVE-2022-33248 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory corruption in User Identity Module due to integer overflow to buffer overflow when a segement is received via qmi http.
local
low complexity
qualcomm CWE-190
7.8
2023-02-12 CVE-2022-33271 Out-of-bounds Read vulnerability in Qualcomm products
Information disclosure due to buffer over-read in WLAN while parsing NMF frame.
network
low complexity
qualcomm CWE-125
7.5