Vulnerabilities > Qualcomm > Sd670 Firmware > Critical
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-10-19 | CVE-2022-25687 | Classic Buffer Overflow vulnerability in Qualcomm products memory corruption in video due to buffer overflow while parsing asf clips in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |
| 2022-06-14 | CVE-2022-22087 | Classic Buffer Overflow vulnerability in Qualcomm products memory corruption in video due to buffer overflow while parsing mkv clip with no codechecker in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2022-06-14 | CVE-2022-22086 | Double Free vulnerability in Qualcomm products Memory corruption in video due to double free while parsing 3gp clip with invalid meta data atoms in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2022-06-14 | CVE-2021-35083 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to improper validation of certificate chain in SSL or Internet key exchange in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.4 |
| 2021-09-17 | CVE-2021-1976 | Use After Free vulnerability in Qualcomm products A use after free can occur due to improper validation of P2P device address in PD Request frame in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |
| 2021-09-09 | CVE-2021-1933 | Improper Validation of Array Index vulnerability in Qualcomm products UE assertion is possible due to improper validation of invite message with SDP body in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 10.0 |
| 2021-09-08 | CVE-2021-1972 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of device types during P2P search in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 10.0 |
| 2021-09-08 | CVE-2021-1920 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur due to improper handling of incoming RTCP packets in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2021-09-08 | CVE-2021-1919 | Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products Integer underflow can occur when the RTCP length is lesser than than the actual blocks present in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |
| 2021-09-08 | CVE-2021-1916 | Out-of-bounds Write vulnerability in Qualcomm products Possible buffer underflow due to lack of check for negative indices values when processing user provided input in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Voice & Music, Snapdragon Wearables | 10.0 |