Vulnerabilities > Qualcomm > Sd670 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-07-04 | CVE-2023-22667 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory Corruption in Audio while allocating the ion buffer during the music playback. | 7.8 |
| 2023-07-04 | CVE-2023-28542 | Out-of-bounds Read vulnerability in Qualcomm products Memory Corruption in WLAN HOST while fetching TX status information. | 7.8 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-33307 | Double Free vulnerability in Qualcomm products Memory Corruption due to double free in automotive when a bad HLOS address for one of the lists to be mapped is passed. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-06-06 | CVE-2022-40523 | Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products Information disclosure in Kernel due to indirect branch misprediction. | 5.5 |
| 2023-06-06 | CVE-2022-40529 | Incorrect Authorization vulnerability in Qualcomm products Memory corruption due to improper access control in kernel while processing a mapping request from root process. | 7.8 |
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |