Vulnerabilities > Qualcomm > Sd670 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-09-05 | CVE-2023-28558 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN handler while processing PhyID in Tx status handler. | 7.8 |
| 2023-09-05 | CVE-2023-28559 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28560 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing devIndex from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28564 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while passing command parameters through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28565 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command streams through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-28567 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while handling command through WMI interfaces. | 7.8 |
| 2023-09-05 | CVE-2023-33021 | Use After Free vulnerability in Qualcomm products Memory corruption in Graphics while processing user packets for command submission. | 7.8 |
| 2023-08-08 | CVE-2022-40510 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to buffer copy without checking size of input in Audio while voice call with EVS vocoder. | 9.8 |
| 2023-08-08 | CVE-2023-21626 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in HLOS due to improper authentication while performing key velocity checks using more than one key. | 7.1 |
| 2023-08-08 | CVE-2023-21651 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory Corruption in Core due to incorrect type conversion or cast in secure_io_read/write function in TEE. | 7.8 |