Vulnerabilities > Qualcomm > Sd670 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-10-03 | CVE-2023-24849 | Unspecified vulnerability in Qualcomm products Information Disclosure in data Modem while parsing an FMTP line in an SDP message. | 7.5 |
| 2023-10-03 | CVE-2023-24850 | Improper Validation of Array Index vulnerability in Qualcomm products Memory Corruption in HLOS while importing a cryptographic key into KeyMaster Trusted Application. | 7.8 |
| 2023-10-03 | CVE-2023-33027 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while parsing rsn ies. | 7.5 |
| 2023-09-05 | CVE-2023-21662 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in Core Platform while printing the response buffer in log. | 7.8 |
| 2023-09-05 | CVE-2023-21664 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in Core Platform while printing the response buffer in log. | 7.8 |
| 2023-09-05 | CVE-2023-28538 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WIN Product while invoking WinAcpi update driver in the UEFI region. | 7.8 |
| 2023-09-05 | CVE-2023-28544 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in WLAN while sending transmit command from HLOS to UTF handlers. | 7.8 |
| 2023-09-05 | CVE-2023-28557 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload. | 7.8 |
| 2023-09-05 | CVE-2023-28558 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN handler while processing PhyID in Tx status handler. | 7.8 |
| 2023-09-05 | CVE-2023-28559 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload. | 7.8 |