Vulnerabilities > Qualcomm > Sd670 Firmware
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2022-12-13 | CVE-2022-25681 | Unspecified vulnerability in Qualcomm products Possible memory corruption in kernel while performing memory access due to hypervisor not correctly invalidated the processor translation caches in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
2022-12-13 | CVE-2022-25682 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in MODEM UIM due to usage of out of range pointer offset while decoding command from card in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2022-12-13 | CVE-2022-25695 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in MODEM due to Improper Validation of Array Index while processing GSTK Proactive commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2022-12-13 | CVE-2022-33235 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in WLAN firmware while parsing security context info attributes. | 7.5 |
2022-12-13 | CVE-2022-33238 | Infinite Loop vulnerability in Qualcomm products Transient DOS due to loop with unreachable exit condition in WLAN while processing an incoming FTM frames. | 7.5 |
2022-11-15 | CVE-2022-25724 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in graphics due to buffer overflow while validating the user address in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2022-11-15 | CVE-2022-25743 | Use After Free vulnerability in Qualcomm products Memory corruption in graphics due to use-after-free while importing graphics buffer in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
2022-11-15 | CVE-2022-33234 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in video due to configuration weakness. | 9.8 |
2022-11-15 | CVE-2022-33237 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN firmware while processing PPE threshold. | 7.5 |
2022-10-19 | CVE-2022-25660 | Double Free vulnerability in Qualcomm products Memory corruption due to double free issue in kernel in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |