Vulnerabilities > Qualcomm > Sd670 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-03-10 | CVE-2022-25694 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Modem due to usage of Out-of-range pointer offset in UIM | 7.8 |
| 2023-03-10 | CVE-2022-25705 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption in modem due to integer overflow to buffer overflow while handling APDU response | 7.8 |
| 2023-03-10 | CVE-2022-33213 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in modem due to buffer overflow while processing a PPP packet | 8.8 |
| 2023-03-10 | CVE-2022-33242 | Improper Authentication vulnerability in Qualcomm products Memory corruption due to improper authentication in Qualcomm IPC while loading unsigned lib in audio PD. | 7.8 |
| 2023-03-10 | CVE-2022-33257 | Time-of-check Time-of-use (TOCTOU) Race Condition vulnerability in Qualcomm products Memory corruption in Core due to time-of-check time-of-use race condition during dump collection in trust zone. | 7.0 |
| 2023-03-10 | CVE-2022-33278 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in HLOS when input message size is larger than the buffer capacity. | 7.8 |
| 2023-03-10 | CVE-2022-40515 | Double Free vulnerability in Qualcomm products Memory corruption in Video due to double free while playing 3gp clip with invalid metadata atoms. | 9.8 |
| 2023-03-10 | CVE-2022-40531 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Memory corruption in WLAN due to incorrect type cast while sending WMI_SCAN_SCH_PRIO_TBL_CMDID message. | 7.8 |
| 2023-03-10 | CVE-2022-40537 | Improper Validation of Array Index vulnerability in Qualcomm products Memory corruption in Bluetooth HOST while processing the AVRC_PDU_GET_PLAYER_APP_VALUE_TEXT AVRCP response. | 9.8 |
| 2023-02-12 | CVE-2022-33232 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption due to buffer copy without checking size of input while running memory sharing tests with large scattered memory. | 7.8 |