Vulnerabilities > Qualcomm > Sd665 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-04-07 | CVE-2020-11251 | Out-of-bounds Read vulnerability in Qualcomm products Out-of-bounds read vulnerability while accessing DTMF payload due to lack of check of buffer length before copying in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2021-04-07 | CVE-2020-11247 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound memory read while unpacking data due to lack of offset length check in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.1 |
| 2021-04-07 | CVE-2020-11246 | Double Free vulnerability in Qualcomm products A double free condition can occur when the device moves to suspend mode during secure playback in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2021-04-07 | CVE-2020-11234 | Use After Free vulnerability in Qualcomm products When sending a socket event message to a user application, invalid information will be passed if socket is freed by other thread resulting in a Use After Free condition in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-04-07 | CVE-2020-11231 | Double Free vulnerability in Qualcomm products Two threads call one or both functions concurrently leading to corruption of pointers and reference counters which in turn can lead to heap corruption in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 6.7 |
| 2021-04-07 | CVE-2020-11210 | Out-of-bounds Write vulnerability in Qualcomm products Possible memory corruption in RPM region due to improper XPU configuration in Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2021-04-07 | CVE-2020-11191 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read occurs while processing crafted SDP due to lack of check of null string in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 9.1 |
| 2021-03-17 | CVE-2020-11309 | Use After Free vulnerability in Qualcomm products Use after free in GPU driver while mapping the user memory to GPU memory due to improper check of referenced memory in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2021-03-17 | CVE-2020-11308 | Improper Validation of Array Index vulnerability in Qualcomm products Buffer overflow occurs when trying to convert ASCII string to Unicode string if the actual size is more than required in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.8 |
| 2021-03-17 | CVE-2020-11299 | Classic Buffer Overflow vulnerability in Qualcomm products Buffer overflow can occur in video while playing the non-standard clip in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 9.8 |