Vulnerabilities > Qualcomm > Sd660 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-07-04 | CVE-2023-24854 | Out-of-bounds Write vulnerability in Qualcomm products Memory Corruption in WLAN HOST while parsing QMI WLAN Firmware response message. | 7.8 |
| 2023-07-04 | CVE-2023-28541 | Out-of-bounds Read vulnerability in Qualcomm products Memory Corruption in Data Modem while processing DMA buffer release event about CFR data. | 7.8 |
| 2023-07-04 | CVE-2023-28542 | Out-of-bounds Read vulnerability in Qualcomm products Memory Corruption in WLAN HOST while fetching TX status information. | 7.8 |
| 2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
| 2023-06-06 | CVE-2022-33264 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message. | 7.8 |
| 2023-06-06 | CVE-2022-40507 | Double Free vulnerability in Qualcomm products Memory corruption due to double free in Core while mapping HLOS address to the list. | 7.8 |
| 2023-06-06 | CVE-2022-40521 | Improper Authentication vulnerability in Qualcomm products Transient DOS due to improper authorization in Modem | 7.5 |
| 2023-06-06 | CVE-2023-21628 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in WLAN HAL while processing WMI-UTF command or FTM TLV1 command. | 7.8 |
| 2023-06-06 | CVE-2023-21657 | Improper Input Validation vulnerability in Qualcomm products Memoru corruption in Audio when ADSP sends input during record use case. | 7.8 |
| 2023-06-06 | CVE-2023-21659 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware while processing frames with missing header fields. | 7.5 |