Vulnerabilities > Qualcomm > Sd660 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-12-05 | CVE-2023-28588 | Integer Overflow or Wraparound vulnerability in Qualcomm products Transient DOS in Bluetooth Host while rfc slot allocation. | 7.5 |
| 2023-12-05 | CVE-2023-33018 | Integer Overflow or Wraparound vulnerability in Qualcomm products Memory corruption while using the UIM diag command to get the operators name. | 7.8 |
| 2023-12-05 | CVE-2023-33054 | Improper Authentication vulnerability in Qualcomm products Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data. | 9.1 |
| 2023-12-05 | CVE-2023-33063 | Use After Free vulnerability in Qualcomm products Memory corruption in DSP Services during a remote call from HLOS to DSP. | 7.8 |
| 2023-12-05 | CVE-2023-33070 | Improper Authentication vulnerability in Qualcomm products Transient DOS in Automotive OS due to improper authentication to the secure IO calls. | 5.5 |
| 2023-12-05 | CVE-2023-33079 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Memory corruption in Audio while running invalid audio recording from ADSP. | 7.8 |
| 2023-12-05 | CVE-2023-33080 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. | 7.5 |
| 2023-12-05 | CVE-2023-33088 | NULL Pointer Dereference vulnerability in Qualcomm products Memory corruption when processing cmd parameters while parsing vdev. | 7.8 |
| 2023-12-05 | CVE-2023-33098 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while parsing WPA IES, when it is passed with length more than expected size. | 7.5 |
| 2023-12-05 | CVE-2023-33106 | Use After Free vulnerability in Qualcomm products Memory corruption while submitting a large list of sync points in an AUX command to the IOCTL_KGSL_GPU_AUX_COMMAND. | 7.8 |