Vulnerabilities > Qualcomm > Sd626 Firmware

DATE CVE VULNERABILITY TITLE RISK
2023-07-04 CVE-2023-21629 Double Free vulnerability in Qualcomm products
Memory Corruption in Modem due to double free while parsing the PKCS15 sim files.
low complexity
qualcomm CWE-415
6.8
2023-07-04 CVE-2023-22387 Unspecified vulnerability in Qualcomm products
Arbitrary memory overwrite when VM gets compromised in TX write leading to Memory Corruption.
local
low complexity
qualcomm
7.8
2023-07-04 CVE-2023-22667 Integer Overflow or Wraparound vulnerability in Qualcomm products
Memory Corruption in Audio while allocating the ion buffer during the music playback.
local
low complexity
qualcomm CWE-190
7.8
2023-06-06 CVE-2022-22076 Unspecified vulnerability in Qualcomm products
information disclosure due to cryptographic issue in Core during RPMB read request.
local
low complexity
qualcomm
5.5
2023-06-06 CVE-2022-33264 Out-of-bounds Write vulnerability in Qualcomm products
Memory corruption in modem due to stack based buffer overflow while parsing OTASP Key Generation Request Message.
local
low complexity
qualcomm CWE-787
7.8
2023-06-06 CVE-2022-40521 Improper Authentication vulnerability in Qualcomm products
Transient DOS due to improper authorization in Modem
network
low complexity
qualcomm CWE-287
7.5
2023-05-02 CVE-2022-40504 Reachable Assertion vulnerability in Qualcomm products
Transient DOS due to reachable assertion in Modem when UE received Downlink Data Indication message from the network.
network
low complexity
qualcomm CWE-617
7.5
2023-05-02 CVE-2023-21665 Incorrect Type Conversion or Cast vulnerability in Qualcomm products
Memory corruption in Graphics while importing a file.
local
low complexity
qualcomm CWE-704
7.8
2023-05-02 CVE-2023-21666 Memory Leak vulnerability in Qualcomm products
Memory Corruption in Graphics while accessing a buffer allocated through the graphics pool.
local
low complexity
qualcomm CWE-401
7.8
2023-04-13 CVE-2022-33289 Improper Validation of Array Index vulnerability in Qualcomm products
Memory corruption occurs in Modem due to improper validation of array index when malformed APDU is sent from card.
low complexity
qualcomm CWE-129
6.8