Vulnerabilities > Qualcomm > Sd460 Firmware > Medium
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2021-09-09 | CVE-2021-1960 | Improper Input Validation vulnerability in Qualcomm products Improper handling of ASB-C broadcast packets with crafted opcode in LMP can lead to uncontrolled resource consumption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 6.5 |
| 2021-09-09 | CVE-2021-1961 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to lack of offset length check while updating the buffer value in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2021-09-09 | CVE-2021-1963 | Use After Free vulnerability in Qualcomm products Possible use-after-free due to lack of validation for the rule count in filter table in IPA driver in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2021-09-08 | CVE-2021-1904 | Incorrect Comparison vulnerability in Qualcomm products Child process can leak information from parent process due to numeric pids are getting compared and these pid can be reused in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 5.5 |
| 2021-09-08 | CVE-2021-1929 | Unspecified vulnerability in Qualcomm products Lack of strict validation of bootmode can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2021-07-13 | CVE-2021-1931 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of buffer length while processing fast boot commands in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 6.7 |
| 2021-06-09 | CVE-2020-11160 | Integer Overflow or Wraparound vulnerability in Qualcomm products Resource leakage issue during dci client registration due to reference count is not decremented if dci client registration fails in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 6.7 |
| 2021-05-07 | CVE-2020-11293 | Out-of-bounds Read vulnerability in Qualcomm products Out of bound read can happen in Widevine TA while copying data to buffer from user data due to lack of check of buffer length received in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.0 |
| 2021-05-07 | CVE-2021-1906 | Improper Handling of Exceptional Conditions vulnerability in Qualcomm products Improper handling of address deregistration on failure can lead to new GPU address allocation failure. | 5.5 |
| 2021-04-07 | CVE-2020-11252 | Out-of-bounds Read vulnerability in Qualcomm products Trustzone initialization code will disable xPU`s when memory dumps are enabled and lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 5.5 |