Vulnerabilities > Qualcomm > Sd460 Firmware > Medium
DATE | CVE | VULNERABILITY TITLE | RISK |
---|---|---|---|
2024-07-01 | CVE-2024-21462 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS while loading the TA ELF file. | 5.5 |
2023-12-05 | CVE-2023-28586 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE. | 6.5 |
2023-11-07 | CVE-2023-28563 | Unspecified vulnerability in Qualcomm products Information disclosure in IOE Firmware while handling WMI command. | 5.5 |
2023-11-07 | CVE-2023-28566 | Unspecified vulnerability in Qualcomm products Information disclosure in WLAN HAL while handling the WMI state info command. | 5.5 |
2023-11-07 | CVE-2023-28568 | Unspecified vulnerability in Qualcomm products Information disclosure in WLAN HAL when reception status handler is called. | 5.5 |
2023-11-07 | CVE-2023-28569 | Unspecified vulnerability in Qualcomm products Information disclosure in WLAN HAL while handling command through WMI interfaces. | 5.5 |
2023-07-04 | CVE-2023-21629 | Double Free vulnerability in Qualcomm products Memory Corruption in Modem due to double free while parsing the PKCS15 sim files. | 6.8 |
2023-06-06 | CVE-2022-22076 | Unspecified vulnerability in Qualcomm products information disclosure due to cryptographic issue in Core during RPMB read request. | 5.5 |
2023-06-06 | CVE-2022-40523 | Exposure of Resource to Wrong Sphere vulnerability in Qualcomm products Information disclosure in Kernel due to indirect branch misprediction. | 5.5 |
2023-06-06 | CVE-2022-40533 | Improper Restriction of Operations within the Bounds of a Memory Buffer vulnerability in Qualcomm products Transient DOS due to untrusted Pointer Dereference in core while sending USB QMI request. | 5.5 |