Vulnerabilities > Qualcomm > Sd460 Firmware > High
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-04-01 | CVE-2021-30333 | Out-of-bounds Write vulnerability in Qualcomm products Improper validation of buffer size input to the EFS file can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-04-01 | CVE-2021-35103 | Out-of-bounds Write vulnerability in Qualcomm products Possible out of bound write due to improper validation of number of timer values received from firmware while syncing timers in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-04-01 | CVE-2021-35105 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-04-01 | CVE-2021-35106 | Out-of-bounds Read vulnerability in Qualcomm products Possible out of bound read due to improper length calculation of WMI message. | 7.8 |
| 2022-02-11 | CVE-2021-30317 | Improper Authentication vulnerability in Qualcomm products Improper validation of program headers containing ELF metadata can lead to image verification bypass in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 7.8 |
| 2022-02-11 | CVE-2021-30318 | Classic Buffer Overflow vulnerability in Qualcomm products Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-02-11 | CVE-2021-35069 | Integer Overflow or Wraparound vulnerability in Qualcomm products Improper validation of data length received from DMA buffer can lead to memory corruption. | 7.8 |
| 2022-02-11 | CVE-2021-35077 | Use After Free vulnerability in Qualcomm products Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | 7.8 |
| 2022-01-13 | CVE-2021-30285 | Improper Input Validation vulnerability in Qualcomm products Improper validation of memory region in Hypervisor can lead to incorrect region mapping in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking | 8.8 |
| 2022-01-13 | CVE-2021-30300 | Incorrect Type Conversion or Cast vulnerability in Qualcomm products Possible denial of service due to incorrectly decoding hex data for the SIB2 OTA message and assigning a garbage value to choice when processing the SRS configuration in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables | 7.5 |