Vulnerabilities > Qualcomm > Sd460 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2023-02-12 | CVE-2022-33271 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in WLAN while parsing NMF frame. | 7.5 |
| 2023-02-12 | CVE-2022-33277 | Classic Buffer Overflow vulnerability in Qualcomm products Memory corruption in modem due to buffer copy without checking size of input while receiving WMI command. | 7.8 |
| 2023-02-12 | CVE-2022-40512 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS in WLAN Firmware due to buffer over-read while processing probe response or beacon. | 7.5 |
| 2023-02-12 | CVE-2022-40514 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption due to buffer copy without checking the size of input in WLAN Firmware while processing CCKM IE in reassoc response frame. | 9.8 |
| 2023-01-09 | CVE-2022-22088 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Bluetooth HOST due to buffer overflow while parsing the command response received from remote | 8.8 |
| 2023-01-09 | CVE-2022-33284 | Out-of-bounds Read vulnerability in Qualcomm products Information disclosure due to buffer over-read in WLAN while parsing BTM action frame. | 6.5 |
| 2023-01-09 | CVE-2022-33285 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while parsing WLAN CSA action frames. | 6.5 |
| 2023-01-09 | CVE-2022-33286 | Out-of-bounds Read vulnerability in Qualcomm products Transient DOS due to buffer over-read in WLAN while processing 802.11 management frames. | 6.5 |
| 2023-01-09 | CVE-2022-40516 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in Core due to stack-based buffer overflow. | 7.8 |
| 2023-01-09 | CVE-2022-40517 | Out-of-bounds Write vulnerability in Qualcomm products Memory corruption in core due to stack-based buffer overflow | 7.8 |