Vulnerabilities > Qualcomm > Sd460 Firmware

DATE CVE VULNERABILITY TITLE RISK
2022-04-01 CVE-2021-35105 Incorrect Type Conversion or Cast vulnerability in Qualcomm products
Possible out of bounds access due to improper input validation during graphics profiling in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-704
7.2
2022-04-01 CVE-2021-35106 Out-of-bounds Read vulnerability in Qualcomm products
Possible out of bound read due to improper length calculation of WMI message.
local
low complexity
qualcomm CWE-125
7.2
2022-02-11 CVE-2021-30317 Improper Authentication vulnerability in Qualcomm products
Improper validation of program headers containing ELF metadata can lead to image verification bypass in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-287
7.2
2022-02-11 CVE-2021-30318 Classic Buffer Overflow vulnerability in Qualcomm products
Improper validation of input when provisioning the HDCP key can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm CWE-120
4.6
2022-02-11 CVE-2021-30324 Classic Buffer Overflow vulnerability in Qualcomm products
Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-120
4.6
2022-02-11 CVE-2021-30325 Improper Validation of Array Index vulnerability in Qualcomm products
Possible out of bound access of DCI resources due to lack of validation process and resource allocation in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-129
4.6
2022-02-11 CVE-2021-35068 NULL Pointer Dereference vulnerability in Qualcomm products
Lack of null check while freeing the device information buffer in the Bluetooth HFP protocol can lead to a NULL pointer dereference in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables
network
low complexity
qualcomm CWE-476
7.5
2022-02-11 CVE-2021-35069 Integer Overflow or Wraparound vulnerability in Qualcomm products
Improper validation of data length received from DMA buffer can lead to memory corruption.
local
low complexity
qualcomm CWE-190
7.2
2022-02-11 CVE-2021-35077 Use After Free vulnerability in Qualcomm products
Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
local
low complexity
qualcomm CWE-416
7.2
2022-01-13 CVE-2021-30285 Improper Input Validation vulnerability in Qualcomm products
Improper validation of memory region in Hypervisor can lead to incorrect region mapping in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-20
4.6