Vulnerabilities > Qualcomm > Sd460 Firmware
| DATE | CVE | VULNERABILITY TITLE | RISK |
|---|---|---|---|
| 2022-06-14 | CVE-2021-30345 | Unspecified vulnerability in Qualcomm products RPM secure Stream can access any secure resource due to improper SMMU configuration in Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2022-06-14 | CVE-2021-30346 | Unspecified vulnerability in Qualcomm products RPM secure Stream can access any secure resource due to improper SMMU configuration in Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2022-06-14 | CVE-2021-30349 | Unspecified vulnerability in Qualcomm products Improper access control sequence for AC database after memory allocation can lead to possible memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 6.7 |
| 2022-06-14 | CVE-2021-30350 | Improper Validation of Specified Quantity in Input vulnerability in Qualcomm products Lack of MBN header size verification against input buffer can lead to memory corruption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-35071 | Out-of-bounds Read vulnerability in Qualcomm products Possible buffer over read due to lack of size validation while copying data from DBR buffer to RX buffer and can lead to Denial of Service in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking | 5.5 |
| 2022-06-14 | CVE-2021-35072 | Improper Validation of Array Index vulnerability in Qualcomm products Possible buffer overflow due to improper validation of array index while processing external DIAG command in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | 7.8 |
| 2022-06-14 | CVE-2021-35078 | Memory Leak vulnerability in Qualcomm products Possible memory leak due to improper validation of certificate chain length while parsing server certificate chain in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 7.5 |
| 2022-06-14 | CVE-2021-35079 | Improper Preservation of Permissions vulnerability in Qualcomm products Improper validation of permissions for third party application accessing Telephony service API can lead to information disclosure in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | 5.5 |
| 2022-06-14 | CVE-2021-35080 | Information Exposure vulnerability in Qualcomm products Disabled SMMU from secure side while RPM is assigned a secure stream can lead to information disclosure in Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | 5.5 |
| 2022-06-14 | CVE-2021-35081 | Classic Buffer Overflow vulnerability in Qualcomm products Possible buffer overflow due to improper validation of SSID length received from beacon or probe response during an IBSS session in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music | 9.8 |