Vulnerabilities > Qualcomm > Sd429 Firmware > High

DATE CVE VULNERABILITY TITLE RISK
2021-02-22 CVE-2020-11269 Integer Overflow or Wraparound vulnerability in Qualcomm products
Possible memory corruption while processing EAPOL frames due to lack of validation of key length before using it in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
low complexity
qualcomm CWE-190
8.8
2021-02-22 CVE-2020-11204 Out-of-bounds Write vulnerability in Qualcomm products
Possible memory corruption and information leakage in sub-system due to lack of check for validity and boundary compliance for parameters that are read from shared MSG RAM in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
local
low complexity
qualcomm CWE-787
7.8
2021-02-22 CVE-2020-11203 Out-of-bounds Write vulnerability in Qualcomm products
Stack overflow may occur if GSM/WCDMA broadcast config size received from user is larger than variable length array in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
local
low complexity
qualcomm CWE-787
7.1
2021-02-22 CVE-2020-11177 Unspecified vulnerability in Qualcomm products
User can overwrite Security Code NV item without knowing current SPC due to improper validation of SPC code setting and device lock in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
local
low complexity
qualcomm
8.8
2020-11-12 CVE-2020-11208 Integer Underflow (Wrap or Wraparound) vulnerability in Qualcomm products
Out of Bound issue in DSP services while processing received arguments due to improper validation of length received as an argument' in SD820, SD821, SD820, QCS603, QCS605, SDA855, SA6155P, SA6145P, SA6155, SA6155P, SD855, SD 675, SD660, SD429, SD439
local
low complexity
qualcomm CWE-191
7.8